Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin

By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

A accomplished advisor to 3D MEMS packaging equipment and suggestions Written via specialists within the box, complicated MEMS Packaging serves as a important reference for these confronted with the demanding situations created through the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor provides state of the art MEMS (microelectromechanical platforms) packaging strategies, similar to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you choose trustworthy, inventive, high-performance, powerful, and within your means packaging suggestions for MEMS units. The publication also will reduction in stimulating additional study and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, approaches, production, trying out, and reliability. one of the themes explored: complicated IC and MEMS packaging tendencies MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding concepts Actuation mechanisms and built-in micromachining Bubble swap, optical swap, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05.

2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05.

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